The operation of functional electrochemical interfaces often depends on the organization of the active components. Studies of these interfaces regularly rely on fabrication methods that allow for precise control over structural parameters in order to explicate true structure-function relationships. Examples like photolithography, electron-beam lithography, reactive ion etching, and metal evaporation are generally cost prohibitive for scalable approaches to making these materials. Thus, there is an opportunity to identify processes that translate the strategies derived from research prototypes to new methods of low-cost surface fabrication. Here, we describe recent efforts to fabricate hierarchically structured noble metal interfaces via the direct photolithography of cuprous oxide thin films using photoelectrodeposition. Galvanic replacement reactions (GRR) can be used to modify the surface by exchanging Cu for metals like Au or Ag. We will outline experiments to show how GRR can be controlled on Cu2O electrodes and the resultant surface chemistry of these modifications. Further we explore how patterned Cu2O can be used as a sacrificial intermediate for GRR-driven metallization. This provides the ability to engineer functional electrochemical surfaces in an inexpensive, scalable, and generalizable way.