Dipanwita Dutta1 Dariusz Jarzabek2 Schift Helmut1 Zygmunt Rymuza2 Thomas Jung1

1, Paul Scherrer Institute, Villigen, , Switzerland
2, 2Institute of Micromechanics and Photonics, Warsaw University of Technology, Warsaw, , Poland

Nano Fracture Mechanics involves the study of interface adhesion and fracture by stuying well-defined nano-pillars with the scanning force microscope. In this presentation the focus is given to the methods specifically revealing the mechanical properties and fracture thresholds of oxide with respect to semiconductor interfaces like SiO2/Si and SiO2/SiC as they are relevant for electronic and MEMS device manufacturing. Through load /unload cycles also called force versus distance curves elastic and plastic properties can be assessed at different time scales. In the different imaging modes, frictional forces can be measured as they depend on the applied force ‘loading’ and as they induce elastic deformation or delamination of nanopillars containing a material interface. In adition to the Nano-fracture mechanics investigations, an in-depth investigation of defects at these interfaces by Microscopic and Spectroscopic Nanoanalysis using STEM and HR-TEM will also be presented.

A specific focus will be given to the application of SFM fracture mechanics towards the investigation of time dependent changes in mechanical properties like in the threshold for fracture due to load/unload cycles (fatigue), thermal cycles (diffusion) and the modifications of elasticity and plasticity due to the presence and creation of defects, due to ‘slow’ processes like the interaction with fluids via the solubilisation and the modification of the surface and interface layers.

1. Influence of Alkali Ions on Tribological Properties of Silicon Surface, Dariusz M. Jarzabek, Dorota Siewert, Wojciech Fabianowski, Helmut Schift, Zygmunt Rymuza, Thomas Jung, Tribol Lett (2015) 60, 28 DOI 10.1007/s11249-015-0603-5

2. Elastic modulus and fracture strength evaluation on the nanoscale by scanning force microscope experiments D M Jarzabek, A N Kaufmann, H Schift, Z Rymuza and T A Jung, doi:10.1088/0957-4484/25/21/215701

3. D. Jarzabek et al manuscript in preparation.