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MA01.03.02 : The Preparation of Antioxidant Copper Ink and Its Application on Flexible Substrates

5:00 PM–7:00 PM Apr 3, 2018

PCC North, 300 Level, Exhibit Hall C-E

Description
Wei-Yang Ma1 Chih-Min Chuang1 Cheng-Si Tsao1 Charn-Ying Chen1

1, Institute of Nuclear Energy Research, Taoyuan, , Taiwan

Conductive films have attracted much attention in the printed electronics industry. To date, expensive conductive silver inks have been utilized widely in these conductive films, which ultimately increase the cost. Hence the alternative low-cost copper inks will be of great interest in the future. This paper will present how to synthesize antioxidative conductive copper inks applicable to flexible substrates. The antioxidative conductive copper inks were prepared by dispersing the antioxidative copper particles in diethylene glycol with the bisphenol-F type BEF170 epoxy resin as a binder and the Methyl-5-norbornene-2,3-dicarboxylic anhydride (NMA) as a curing agent, then were coated on PI and PET substrates to form the copper films, followed by sintering by intense pulsed light in air . We found that the formation of three-dimensional structure between BFE170 binder and curing agent NMA don’t affect the conductivities of copper films, and meanwhile can enhance the adhesion strength on PI and PET substrates. The lowest resistivities of 535 μΩcm on PI substrates and 865μΩcm on PET substrates were determined by using the four-point probe method and the highest adhesion of no peeling after the peel-off test with 3M Scotch 600 tape were achieved with the copper ink composed of BEF170 epoxy resin binder mixed with curing agent NMA in an equivalent ratio of 1:1.

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