William Roesch1

1, Qorvo, Hillsboro, Oregon, United States

This presentation is intended to give a non-traditional look at reliability of compound semiconductor RF products. It is a review of the five main stages of reliability analysis. Although essential, the first three stages are separated as those traditional tests which are particularly applicable for process development and material selection phases. The remaining two reliability stages are the focus of real life products. These later stages are the tools used for improving reliability of established processes and families of products where significant changes and switches to new materials are not feasible. While all five steps are necessary in reliability studies, the methods of establishing and improving reliability are different.