In Electronics the term Failure analysis (FA) indicates the process of analyzing a failed electron devices to determine the reason for degraded performance or catastrophic failure and to provide corrective actions able to fix the problem. This procedure starts from the observation of the failure mode to discovery the failure mechanism, the physical cause responsible for the damage.
Failure Analysis has at least three tasks.: 1) Technical/scientific: to find the failure mechanism, in order to point out the acceleration factors and rules for predicting the MTTF; 2) Technological: to address corrective actions in manufacturing processes; 3) Economical: to define responsibilities, between manufacturer and customer, in case of failure.[1,2]
During a complex FA the final step of a chain reaction could be observed as the cumulative effect produced by several events that one after another finally lead the device to fail. A large number of correlated factors must be understood to recognize and remove the origin of the domino effect which is the root cause of the observed final failure.
Failure Analysis has logics and rules  here explained in terms of good and bad practices with the aim to demonstrate what Failure Analysis should be and should do, to show why and how it often does not.
Special emphasis will be placed on case studies of optoelectronic devices.
 G.Mura, M.Vanzi “Logics of Failure Analysis: 20 Years of rules of the Rue Morgue” Proc. Of Physical and Failure Analysis of Integrated Circuits (IPFA), pp. 379-382 , 2016
 G.Mura, M.Vanzi “Faulty Failure Analysis” Proc. Of Physical and Failure Analysis of Integrated Circuits (IPFA), pp. 599-602, 2013
 G.Mura, M.Vanzi "Failure Analysis of Failure Analyses: The Rules of the Rue Morgue Ten Years Later", IEEE TDMR, vol. 7, pp. 446-452, 2007